Refined for Performance & Style
⬢ Bundled Flex Kit for Modular Upgrades
⬢ Mobius 120P Fans
⬢ Thicker Radiator for Better Performance
⬢ Ultra-low Profile Pump Design
⬢ Easy Installation
The VRM fan module cools motherboard hot zones with airflow in six directions. It can reduce temperatures by up to 10.2°C*, to improve both stability and performance.
*Tested by Cooler Master Lab.
Validated by Cooler Master Lab, the VRM fan delivers targeted cooling, reducing temperatures by up to 10.2°C across critical components for enhanced performance and stability.
Our latest patented dual chamber design has been refined for enhanced cooling synergy. The new design increases water pressure and optimizes water flow directly to CPU hot spot.
Fully automated production and assembly of the pump with fully recorded production history.
Engineered with PPS and fiberglass, the MasterLiquid Atmos II pump housing delivers industrial-grade strength, exceptional heat resistance, and unmatched durability—designed for builders who demand long-lasting, high-performance cooling. It also passes extreme testing at 70°C for 3,000 hours and 120 °C for 12 hours*, ensuring reliable performance under the harshest conditions.
*Tested by Cooler Master Lab using only the liquid cooling module. Results may vary by system and conditions.
Interchangeablemagnetictop covers offer versatile customization and effortless swapping.This kit includes base, metallic,and VRM fan options to meet diverse aesthetic and thermal requirements with ease.
Pressure-optimized fans featuring loop dynamic bearings ensure silent, high-performance airflow even under heavy loads.
An increased radiator thickness—upgraded from 27mm to 29mm—enlarges the heat exchange surface for more efficient heat absorption and dissipation. This enhancement maintains thermal stability during demanding workloads, ensuring reliable cooling when the system reaches peak limits.
The sleek, flat design ensures compatibility with various case sizes while delivering high-performance liquid flow.
A quick-mount kit provides broad compatibility with mainstream processor sockets, while pre-installed fans simplify the setup process.
Due to the varying CPU hotspots across different platforms, there are corresponding mounting bracket solutions tailored for each. We recommend you use the included offset mounting brackets for LGA 1851*, which precisely dissipate 4°C of heat from the center of the CPU.**
*Please check whether your motherboard is compatible with this offset bracket.
**Tested by Cooler Master Lab.