With 33 years of thermal-manufacturing expertise, Cooler Master supplies the precision liquid-cooling components that keep NVIDIA MGX, a modular reference architecture for AI factories, running at peak performance.

TAIPEI, Taiwan, [2026.05.26] Cooler Master, as a global leader in thermal solutions for high-performance computing, continues to expand our global liquid cooling capabilities, delivering comprehensive AI data center thermal solutions ranging from rack-level cooling components to large-scale CDU systems. We have long collaborated with NVIDIA on thermal solutions for high-performance computing. As artificial intelligence continues to reshape the modern economy, NVIDIA MGX™ has become a cornerstone architecture powering the explosive growth of AI factories, while our advanced cooling technologies help ensure stable, efficient, and reliable compute performance.

From Rack-Level Components to Complete AI Thermal Infrastructure

As AI factories continue to scale globally, rack-level thermal performance has become a critical factor in system stability, compute efficiency, and long-term operational reliability. To meet these growing thermal demands, we have evolved beyond component-level manufacturing into a comprehensive provider of end-to-end AI cooling infrastructure solutions.

For high-density AI server environments, we provide advanced liquid cooling cold plate technologies designed to efficiently dissipate heat from next-generation high-power GPUs and CPUs used in modern AI computing platforms.

Beyond cold plate solutions, we continue to expand our development of large-scale Liquid-to-Liquid CDU and Liquid-to-Air CDU systems tailored for modern AI data center environments. Our liquid cooling solutions now support both Primary Side and Secondary Side infrastructure, helping customers build scalable, efficient, and flexible cooling architectures for hyperscale AI deployments.

R&D and Global Manufacturing Strength Built for the AI Era

Cooler Master continues advancing thermal technologies across multiple cooling generations, supporting the industry’s transition from traditional air cooling to single-phase cold plate liquid cooling technologies capable of handling significantly higher thermal design power requirements.

As global investment in AI infrastructure accelerates, manufacturing capability has become just as important as thermal innovation itself. Cooler Master has established a global manufacturing footprint with highly automated production capabilities spanning assembly, soldering, testing, and packaging processes across multiple regions.

This vertically integrated manufacturing model enables Cooler Master to deliver the consistency, reliability, and scalable production capacity required by hyperscale AI customers worldwide. By combining deep thermal engineering expertise with advanced manufacturing capabilities, Cooler Master continues to position ourselves as a trusted long-term strategic partner for global AI infrastructure deployment.

Cooler Master at the heart of the MGX rack

NVIDIA MGX™ is an open and modular reference architecture designed for AI factories, spanning from single-node servers to full rack-scale data center infrastructure. Engineered for 100% liquid cooling with 45°C warm-liquid inlet temperatures, MGX represents the next evolution of high-density AI infrastructure.

Within MGX-based racks, thermal performance is mission-critical, and this is where Cooler Master’s engineering expertise plays a vital role. Cooler Master supplies advanced cold plates that directly remove heat from high-performance GPUs and CPUs, along with coolant distribution manifolds that precisely and reliably distribute liquid throughout the rack.

Together, these thermal solutions form the circulatory system of the MGX architecture, enabling AI racks to sustain extreme compute workloads with exceptional stability and efficiency while maximizing performance density.   

As part of the growing ecosystem building on NVIDIA MGX, Cooler Master helps transform modular reference designs into production-ready AI factory infrastructure for customers worldwide.

Defining the Thermal Efficiency Benchmark of the Computing Era 

As global investment in next-generation computing infrastructure continues to accelerate toward trillions of dollars over the coming decade, reliable thermal management has become more critical than ever.

To support the growing demands of hyperscale deployments, Cooler Master continues investing in next-generation CDU technologies designed to deliver greater cooling capacity, higher thermal efficiency, and improved scalability for modern data center environments.

By combining advanced manufacturing capabilities with forward-looking thermal innovation, Cooler Master continues to strengthen its role as a trusted strategic partner for global infrastructure development.

Cooler Master remains committed to advancing thermal technologies that help drive the future of high-performance computing and next-generation data center infrastructure.