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Thermal Pad
Thermal Pad
Thermal Pad
Thermal Pad
Thermal Pad

Cooling Versatility Everywhere

Thermal Pad

Cooler Master’s new Thermal Pad is an innovative solution to device cooling for a vast range of your electronic devices and components.

FORMULATED WITH NANO ELEMENTS

13.3w/mK thermal conductivity for rapid cooling, capable of drawing high levels of heat.

NON-TOXIC AND NON-CORROSIVE

Safe and simple formula with electrically insulated and heat resistant properties to prevent hardening.

DOUBLE-SIDED ADHESIVE

Provides seamless and secure contact between surfaces.

WIDE RANGE OF APPLICATION

Electronic devices, motherboards, components (CPU, GPU, USICS, Hard Drives, Disk Drives, IGBT module), laptops and various products requiring cooling.

VERSATILE AND EASY APPLICATION

仕様

  • 製品型番 TPX-NOPP-9005-R1, TPX-NOPP-9010-R1, TPX-NOPP-9020-R1, TPX-NOPP-9030-R1
  • 製品寸法 (L x W x H) 95 x 45 mm
  • 熱伝導率 13.3 (W/m.K)
  • カラー パープル
  • 密度 3.4 ± 0.2 g/cc
  • 硬度 30~60 Sc
  • 降伏電圧 6KV (1mm)
  • 使用温度 -40 ~ 200°C
  • クーラー分類 サーマルグリス

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