多樣酷冷新選擇
Cooler Master新的導熱片Thermal Pad Pro產品為一創新的產品。設計給您搭配所有您可能使用到的電子裝置。
COOLING VERSATILITY EVERYWHERE
Formulated with Nano Diamond Particles
Non-toxic and Non-corrosive
Double-sided Adhesive
Versatile and Easy Application.
Cooler Master's new Thermal Pad Pro is an innovative solution to device cooling for a vast range of your electronic devices and components.
COOLING VERSATILITY EVERYWHERE
15.3w/mK thermal conductivity for rapid cooling, capable of drawing high levels of heat.
Safe and simple formula with electrically insulated and heat resistant properties to prevent hardening.
Provides seamless and secure contact between surfaces.
Easily cut to the perfect size for your application. Choices of 1mm and 2mm thickness are available.
Electronic devices, motherboards, components (CPU, GPU, USICS, Hard Drives, Disk Drives, IGBT module), laptops and various products requiring cooling.