Global Headquarters
No. 398, Xinhu 1st Rd, Neihu District, Taipei City, 114, Taiwan
Cooler, Quieter, Stronger
Industry-Leading Noise-Normalized Cooling Performance
More Balanced Intake–Exhaust Architecture
Split-Level Layout for Enhanced Airflow
MasterRail Multi-Purpose Mounting System
Supports Versatile GPU configurations
The HAF II 500 is the next evolution of Cooler Master’s High Air Flow series, engineered to deliver industry-leading noise-normalized cooling performance. At the core of its design are some of the largest and thickest fans in the consumer market, paired with optimized airflow engineering to maximize cooling efficiency, enabling lower component temperatures at reduced system operating noise.
Combined with Cooler Master’s FreeForm 2.0 philosophy, it gives builders flexible control over system design, fan layout, GPU configuration, and storage, unlocking maximum performance and experience for enthusiasts and overclocking builds.
Dual 220x40 mm intake fans and a 180x40 mm exhaust fan work together to maintain airflow balance, improving cooling efficiency beyond traditional airflow-focused chassis designs.
Designed to support AI, rendering, simulation, and other GPU-compute-intensive workloads.
COSMOS series, hailed as the ultimate expression of PC case modularity, evolves into the “halo” platform for enthusiasts and modders. With its iconic design language and enhanced modular internals, COSMOS is engineered for boundary-pushers who want limitless control over layout, cooling, and customization.
Brand new COSMOS ALPHA will serve as the aspirational apex of what FreeForm 2.0 stands for — freedom, scale, and personalization without compromise, making it an ALPHA case for all ALPHA builders


* Maximum combined fan and radiator thickness: 58 mm
** Maximum combined fan and radiator thickness: 72 mm
Airflow divider must be removed.
MasterRail enables flexible fan and radiator placement for custom setups and easy upgrades.
Split-level cable routing, a sliding motherboard cover, and a dedicated cable chamber keep builds clean while optimizing airflow efficiency.


Supports extreme multi-GPU configurations for high-performance computing and intensive workloads.