With enhanced thermally conductive non-curing compound, IceFusion provides excellent performance and stability. It is optimized for use between CPUs, and heatsinks or water-cooling solutions.

1. High Thermal Conductivity.
2. Low Thermal Resistance.
3. Non-Corrosive.
4. Best Thermal Stability in High Temperature.
5. Excellent Adhesion.
6. Preservation in Room Temperature.
7. Easy Application with Included Razor Blade.