Home / Cooling / CPU Air Cooler / TPC 812
- The TPC 812 uses 2 separate cooling technologies to transfer heat – heat pipes and vertical vapor chambers.
- Ready for overclocking, benchmarking and silent cooling.
- The first-ever CPU heatsink to use vertical vapor chamber technology.
- 100% pure polished copper base – combined with improved soldering technologies for the best thermal transfer.
- Special fin design – heatsink receives concentrated cold airflow.
- Improved air pressure design and fan mounting system.