TPC 812

  • The TPC 812 uses 2 separate cooling technologies to transfer heat – heat pipes and vertical vapor chambers.
  • Ready for overclocking, benchmarking and silent cooling.
  • The first-ever CPU heatsink to use vertical vapor chamber technology.
  • 100% pure polished copper base – combined with improved soldering technologies for the best thermal transfer.
  • Special fin design – heatsink receives concentrated cold airflow.
  • Improved air pressure design and fan mounting system.