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TPC 800 (EU only)
- The TPC 800 uses 2 separate cooling technologies to transfer heat – heat pipes and vertical vapor chambers.
- The first-ever CPU heatsink to use vertical vapor chamber technology.
- 100% pure polished copper base – combined with improved soldering technologies for the best thermal transfer.
- Special fin design – heatsink receives concentrated cold airflow.
- Improved air pressure design and fan mounting system.