Hyper 212X

  • High performance Copper heatpipes with a fusion bonded copper powder wick.
  • Patented CDC™ technology – 4 direct touch heatpipes creating a gap-less contact surface
  • Aluminum Fin Array with New Tunnel Effect layout for improved heat dissipation.
  • 4th Generation Bearing – MTBF of 160,000 hours thanks to highly durable POM components.
  • Redesigned Fan-blades that create vortices to boost airflow without creating more noise.
  • Smart Fan engine – stops the fan when blocked to prevent damage, and automatically restarts the fan when it has been cleared.
  • Universal mounting system for all Intel and AMD platforms.